Circuit Outline

With an x-height of 81.5% of the cap height, its lowercase stands above the 76.2% median for display fonts, taller than 89 of the 97 other display fonts. Ascenders on b, d, h, k and l rise 3.3% above the capitals, and descenders on g, j, p, q and y drop 23.1% of the cap height below the baseline, shallower than 56 of the 97 other display fonts. It sets wide: an average lowercase letter, spacing included, is 110.7% as wide as the capitals are tall (an average capital, 122.7%), 23.8% more than the median for display fonts, so the same words take a longer line. The o is wider than it is tall, 1.32 to 1, and W is the widest capital, at 1.29 times the width of H. Round letters overshoot: O rises 1.1% of the cap height above H and dips 1.1% below the baseline.

Ink covers 15.7% of each lowercase letter's box (its advance width by the cap height), lighter than 93 of the 97 other display fonts. The letters are hollow: every stroke is drawn as a thin outline band.

Its 3,966 characters include 3,756 Chinese and 105 Latin letters, plus 105 figures, punctuation marks and symbols; 53 of the Latin letters are accented or special forms beyond A to Z. The word space measures 42.1% of the cap height, and the blank space either side of a lowercase letter takes up 16.1% of its width. Spacing is adjusted with 96 kerning pairs, more than 60 of the 97 other display fonts. The tightest of them is AY, which closes up by 26.7% of the cap height. The figures have different widths, so columns of numbers set in Circuit Outline will not line up exactly.

Circuit Outline is drawn on the same letter structure as 9 other fonts in the library. Compared with Circuit Outline, Hyper 3D adds a 3D extrusion, sets 9% narrower and puts down 163% more ink. Hull Block keeps the letters plain, without the outline effect and puts down 157% more ink. Bubble Tech Outline has a 77% x-height and adds Korean (2,350 common syllables).